Dymax adds low-viscosity medical adhesive to HLC portfolio
By AI, Created 6:36 PM UTC, May 26, 2026, /AGP/ – Dymax on May 27, 2026, launched HLC-M-1004, a low-viscosity adhesive aimed at medical device assembly with bonding performance in both light-exposed and shadowed areas. The new product is designed to help manufacturers of catheters, diagnostic and therapeutic devices, and other complex parts improve dispensing, cure speed, and production efficiency.
Why it matters: - HLC-M-1004 is built for medical device assembly where opaque materials and tight bond gaps can make curing and bonding harder. - The adhesive is designed to help manufacturers achieve reliable bonds without primers while supporting faster throughput. - The launch extends Dymax’s HLC Adhesives portfolio in a market that depends on consistent assembly performance and biocompatibility review.
What happened: - Dymax announced HLC-M-1004, a new low-viscosity adhesive in its HLC™ Adhesives line. - The company said the release was made on May 27, 2026. - The product is intended to support efficient assembly of complex medical devices.
The details: - HLC-M-1004 uses a hybrid light-curable platform that supports curing in both light-exposed and shadowed areas. - The adhesive combines on-contact cure in dark areas with rapid, low-intensity UV or visible-light curing. - The material is suited for catheters, diagnostic and therapeutic devices, and other parts that use opaque or light-blocking substrates. - Low viscosity supports controlled dispensing and penetration into tight bond gaps. - The adhesive is designed to form consistent bonds without primers. - Additional performance features include limited blooming with proper light curing, flexibility after cure, and improved aesthetics. - The material provides rapid fixturing for high-throughput manufacturing. - HLC-M-1004 was evaluated in accordance with applicable ISO 10993 biocompatibility standards. - The adhesive contains no nonreactive solvents. - As a one-part material, HLC-M-1004 is intended to simplify processes, reduce waste, and improve production efficiency.
Between the lines: - Dymax is positioning the product as a process improvement tool as much as a bonding material. - The focus on shadowed-area curing suggests the company is targeting manufacturing problems that standard light-cure adhesives can struggle to solve. - The biocompatibility evaluation signals that Dymax wants the product to fit medical-device workflows where material qualification matters.
What’s next: - Dymax said it will continue expanding the HLC Adhesive family to address evolving bonding challenges in medical device assembly. - More information is available at Dymax. - Dymax also provided its phone number, 860-482-1010, for additional information.
Disclaimer: This article was produced by AGP Wire with the assistance of artificial intelligence based on original source content and has been refined to improve clarity, structure, and readability. This content is provided on an “as is” basis. While care has been taken in its preparation, it may contain inaccuracies or omissions, and readers should consult the original source and independently verify key information where appropriate. This content is for informational purposes only and does not constitute legal, financial, investment, or other professional advice.
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